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  • UNIVERSAL BOND [WOE]

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Self-curing, universal binding system. Excellent adhesion for all procedures, techniques and materials. Adhesive system designed for both direct and indirect reconstructions. Tokuyama Universal Bond can be used in self-etching, selective etching and total etching techniques.


Tokuyama Universal Bond A / 5 ml
Tokuyama Universal Bond B / 5 ml

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